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1 подложка интегральной схемы
Русско-английский политехнический словарь > подложка интегральной схемы
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2 подложка интегральной схемы
Русско-английский научно-технический словарь Масловского > подложка интегральной схемы
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3 подложка интегральной схемы
Универсальный русско-английский словарь > подложка интегральной схемы
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4 подложка интегральной микросхемы
1) Engineering: IC substrate, integrated-circuit substrate, integrated-microcircuit substrate2) Electrical engineering: substrate of integrated microcircuitУниверсальный русско-английский словарь > подложка интегральной микросхемы
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5 многослойная подложка
1. multilayer substrate2. multiplanar substrateРусско-английский большой базовый словарь > многослойная подложка
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6 подложка
1) back
2) backing
3) <constr.> base
4) undercoat
– липкая подложка
– подложка катализатора
– подложка кожи
подложка интегральной микросхемы — substrate
подложка интегральной схемы — integrated circuit substrate
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7 керамическая подложка
Русско-английский большой базовый словарь > керамическая подложка
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8 поликристаллическая подложка
Русско-английский большой базовый словарь > поликристаллическая подложка
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9 сапфировая подложка
Русско-английский большой базовый словарь > сапфировая подложка
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10 подложка
ж. back, baseпластмассовая основа ; пластмассовая подложка — plastic base
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11 герметизированная ИС
Русско-английский словарь по информационным технологиям > герметизированная ИС
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12 пленочный ИС
Русско-английский словарь по информационным технологиям > пленочный ИС
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13 устройство на ИС
Русско-английский словарь по информационным технологиям > устройство на ИС
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14 Kilby, Jack St Clair
SUBJECT AREA: Electronics and information technology[br]b. 8 November 1923 Jefferson City, Missouri, USA[br]American engineer who filed the first patents for micro-electronic (integrated) circuits.[br]Kilby spent most of his childhood in Great Bend, Kansas, where he often accompanied his father, an electrical power engineer, on his maintenance rounds. Working in the blizzard of 1937, his father borrowed a "ham" radio, and this fired Jack to study for his amateur licence (W9GTY) and to construct his own equipment while still a student at Great Bend High School. In 1941 he entered the University of Illinois, but four months later, after the attack on Pearl Harbor, he was enlisted in the US Army and found himself working in a radio repair workshop in India. When the war ended he returned to his studies, obtaining his BSEE from Illinois in 1947 and his MSEE from the University of Wisconsin. He then joined Centralab, a small electronics firm in Milwaukee owned by Globe-Union. There he filed twelve patents, including some for reduced titanate capacitors and for Steatite-packing of transistors, and developed a transistorized hearing-aid. During this period he also attended a course on transistors at Bell Laboratories. In May 1958, concerned to gain experience in the field of number processing, he joined Texas Instruments in Dallas. Shortly afterwards, while working alone during the factory vacation, he conceived the idea of making monolithic, or integrated, circuits by diffusing impurities into a silicon substrate to create P-N junctions. Within less than a month he had produced a complete oscillator on a chip to prove that the technology was feasible, and the following year at the 1ERE Show he demonstrated a germanium integrated-circuit flip-flop. Initially he was granted a patent for the idea, but eventually, after protracted litigation, priority was awarded to Robert Noyce of Fairchild. In 1965 he was commissioned by Patrick Haggerty, the Chief Executive of Texas Instruments, to make a pocket calculator based on integrated circuits, and on 14 April 1971 the world's first such device, the Pocketronic, was launched onto the market. Costing $150 (and weighing some 2½ lb or 1.1 kg), it was an instant success and in 1972 some 5 million calculators were sold worldwide. He left Texas Instruments in November 1970 to become an independent consultant and inventor, working on, amongst other things, methods of deriving electricity from sunlight.[br]Principal Honours and DistinctionsFranklin Institute Stuart Ballantine Medal 1966. Institute of Electrical and Electronics Engineers David Sarnoff Award 1966; Cledo Brunetti Award (jointly with Noyce) 1978; Medal of Honour 1986. National Academy of Engineering 1967. National Science Medal 1969. National Inventors Hall of Fame 1982. Honorary DEng Miami 1982, Rochester 1986. Honorary DSc Wisconsin 1988. Distinguished Professor, Texas A \& M University.Bibliography6 February 1959, US patent no. 3,138,743 (the first integrated circuit (IC); initially granted June 1964).US patent no. 3,819,921 (the Pocketronic calculator).Further ReadingT.R.Reid, 1984, Microchip. The Story of a Revolution and the Men Who Made It, London: Pan Books (for the background to the development of the integrated circuit). H.Queisser, 1988, Conquest of the Microchip, Cambridge, Mass.: Harvard University Press.KF -
15 подложка
back, carrier, backing, base, body, base coat, hypophase, bottom layer, substrate layer, (клеенки, линолеума) padding, base plate, support электрон., base stock кфт., substrate, underlying surface, undercoat, wafer* * *подло́жка ж.
back(ing), baseподло́жка гальваностереоти́па полигр. — back-up plateподло́жка интегра́льной схе́мы — integrated-circuit [lC] substrateподло́жка катализа́тора — catalyst carrierподло́жка ко́жи — bedли́пкая подло́жка полигр. — adhesive backingподло́жка печа́тной схе́мы — printed-circuit [P.C.] substrateподло́жка фотоматериа́ла — support, base (см. тж. основа)* * * -
16 многокристальная ИС
1) Engineering: multichip, multichip IC, multichip device, multichip package2) Electronics: compound integration, multiple-substrate solid circuit3) Information technology: multichip integrated circuit4) Microelectronics: compound monolithic integration, multichip circuit, multiple-chip circuitУниверсальный русско-английский словарь > многокристальная ИС
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17 схема на нескольких кристалликах
Русско-английский словарь по информационным технологиям > схема на нескольких кристалликах
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18 ИС на диэлектрической подложке
Electronics: insulated-substrate integrated circuitУниверсальный русско-английский словарь > ИС на диэлектрической подложке
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19 ИС с КНД-структурой
Electronics: insulated-substrate integrated circuitУниверсальный русско-английский словарь > ИС с КНД-структурой
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20 интегральная схема на диэлектрической подложке
Engineering: insulated-substrate integrated circuitУниверсальный русско-английский словарь > интегральная схема на диэлектрической подложке
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См. также в других словарях:
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